(10) Wave solder/Hot air leveling tape 1 mil Electrical Grade Polyimide Kapton film coated with a high performance silicone adhesive. Total thickness: 2.6 mil (0.065mm). Thin and conformable, with outstanding tear and abrasion resistance at elevated temperatures. Adhesive will thermoset to increase adhesion values. Leaves minimal residue when removed after manufacturing process; reduces clean-up time and minimizes rejects. Permits observation of board during processing. Excellent resistance to acids, oils, solvents, aging, staining, water immersion. Protects gold contacts from molten solder during hot air wave solder leveling process. Adhesion: 25 oz/in. Tensile: 30 Ibs/in. Elongation: 50%. Temp, resistance: -100°F to SOOT ...
ISO 9001: 2000 Certified Company Kapton®, Tedlar®, and Rulon® are registered trademarks of E.I. DuPont De Nemours and Company used under license by Tapes & Technical Solutions.